lily@hopskip-jump.com
86-13712404698
SABIC PEI LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
LNP THERMOCOMP EC004XXC can be used in computer components . is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
Contact: Lily Chan
Phone: 86-13712404698
E-mail: lily@hopskip-jump.com
Whatsapp:86-13712404698
Add: Room 1601, Unit 2, Building 1, Wanhui Centre, No.72 GuanZhang Road, Dongguan, GuangDong, China
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